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OMCVD TiN diffusion barrier for copper contact and via/interconnects structures

✍ Scribed by C. Marcadal; E. Richard; J. Torres; J. Palleau; L. Ulmer; L. Perroud; J. Piaguet; G. Rolland

Book ID: 114155672
Publisher: Elsevier Science
Year: 1997
Tongue: English
Weight: 353 KB
Volume: 37-38
Category: Article
ISSN: 0167-9317
DOI: 10.1016/s0167-9317(97)00112-3

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