✦ LIBER ✦

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

✍ Scribed by W. H. Zhong; Y. C. Chan; B. Y. Wu; M. O. Alam; J. F. Guan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of multiple reflow processes on t

✍ W.H. Zhong; Y.C. Chan; M.O. Alam; B.Y. Wu; J.F. Guan 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 853 KB

Mechanical and Electrical Properties of

✍ Ja-Myeong Koo; Bui Quoc Vu; Yu-Na Kim; Jong-Bum Lee; Jong-Woong Kim; Dae-Up Kim; 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 378 KB

Effect of substrate metallization on mec

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Interfacial reactions of Sn–Cu solder wi

✍ M.N. Islam; Y.C. Chan 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 503 KB

Formation and resettlement of (AuxNi1−x)

✍ C. E. Ho; R. Zheng; G. L. Luo; A. H. Lin; C. R. Kao 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 782 KB

Aging study on interfacial microstructur

✍ Kuo-Chin Chang; Kuo-Ning Chiang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 885 KB