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Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

✍ Scribed by Ja-Myeong Koo; Bui Quoc Vu; Yu-Na Kim; Jong-Bum Lee; Jong-Woong Kim; Dae-Up Kim; Jeong-Hoon Moon; Seung-Boo Jung

No coin nor oath required. For personal study only.

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