Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages

✍ Scribed by M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang

• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 810 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0176-9