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Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows

✍ Scribed by Zhong Chen; Aditya Kumar; M. Mona

Publisher: Springer US
Year: 2006
Tongue: English
Weight: 638 KB
Volume: 35
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-006-0322-7

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