✦ LIBER ✦

Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

✍ Scribed by W.H. Zhong; Y.C. Chan; M.O. Alam; B.Y. Wu; J.F. Guan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Multiple reflow study of ball grid array

✍ W. H. Zhong; Y. C. Chan; B. Y. Wu; M. O. Alam; J. F. Guan 📂 Article 📅 2007 🏛 Springer 🌐 English ⚖ 705 KB

Effect of thermal cycling on the solder

✍ G. Sarkar; P. H. Wee; Masrena; M. Kuo; S. N. Mukherjee 📂 Article 📅 2002 🏛 Springer 🌐 English ⚖ 569 KB

Mechanical and Electrical Properties of

✍ Ja-Myeong Koo; Bui Quoc Vu; Yu-Na Kim; Jong-Bum Lee; Jong-Woong Kim; Dae-Up Kim; 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 378 KB

Effect of voids on the reliability of BG

✍ Mohammad Yunus; K. Srihari; J.M. Pitarresi; Anthony Primavera 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 752 KB

Electric current effect on microstructur

✍ B.Y. Wu; Y.C. Chan 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 841 KB

Effects of solder joint structure and sh

✍ R.S. Chen; S.C. Tseng; C.S. Wan 📂 Article 📅 2005 🏛 Springer 🌐 English ⚖ 1006 KB