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Effect of voids on the reliability of BGA/CSP solder joints

✍ Scribed by Mohammad Yunus; K. Srihari; J.M. Pitarresi; Anthony Primavera

Book ID
108361971
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
752 KB
Volume
43
Category
Article
ISSN
0026-2714

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As the electronics industry is moving towards lead-free manufacturing processes, more effort has been put into the reliability study of lead-free solder materials. Various tin-silver-copper-based solders have become widely accepted alternatives for tin-lead solders. In this study, we have tested thr