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Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

โœ Scribed by Jong-Woong Kim; Jin-Kyu Jang; Sang-Ok Ha; Sang-Su Ha; Dae-Gon Kim; Seung-Boo Jung

Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
905 KB
Volume
48
Category
Article
ISSN
0026-2714

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