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Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder joints

✍ Scribed by Jong-Woong Kim; Seung-Boo Jung


Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
908 KB
Volume
371
Category
Article
ISSN
0921-5093

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✍ J. Shen; Y.C. Liu; Y.J. Han; Y.M. Tian; H.X. Gao 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 873 KB

A ZrO 2 nanoparticles strengthened lead-free Sn-3.5Ag-ZrO 2 solder was prepared by mechanically stirring ZrO 2 nanoparticles into the molten melt of eutectic Sn-3.5Ag alloy. The influence of ZrO 2 nanoparticles on the eutectic solidification process, in particular the formation of Ag 3 Sn intermetal