The effect of solder paste composition o
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S. Nurmi; J. Sundelin; E. Ristolainen; T. LepistΓΆ
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Article
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2004
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Elsevier Science
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English
β 565 KB
As the electronics industry is moving towards lead-free manufacturing processes, more effort has been put into the reliability study of lead-free solder materials. Various tin-silver-copper-based solders have become widely accepted alternatives for tin-lead solders. In this study, we have tested thr