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The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

✍ Scribed by Weiping Liu; Ning-Cheng Lee

Book ID
107523172
Publisher
The Minerals, Metals & Materials Society
Year
2007
Tongue
English
Weight
1009 KB
Volume
59
Category
Article
ISSN
1047-4838

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As the electronics industry is moving towards lead-free manufacturing processes, more effort has been put into the reliability study of lead-free solder materials. Various tin-silver-copper-based solders have become widely accepted alternatives for tin-lead solders. In this study, we have tested thr