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Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy

✍ Scribed by Ping Liu; Pei Yao; Jim Liu

Publisher: Springer US
Year: 2008
Tongue: English
Weight: 384 KB
Volume: 37
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-007-0366-3

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