✦ LIBER ✦
Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad
✍ Scribed by Kuo-Chin Chang; Kuo-Ning Chiang
- Publisher
- Springer US
- Year
- 2004
- Tongue
- English
- Weight
- 885 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0361-5235
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