Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

✍ Scribed by Sheng Liu, Yong Liu(auth.)

• Year: 2011
• Tongue: English
• Leaves: 566
• Category: Library

✦ Synopsis

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.  

• Models and simulates numerous processes in manufacturing, reliability and testing for the first time
• Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing
• Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products
• Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects
• Appendix and color images available for download from the book's companion website

Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.

Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packagingContent:
Chapter 1 Constitutive Models and Finite Element Method (pages 1–19):
Chapter 2 Material and Structural Testing for Small Samples (pages 21–44):
Chapter 3 Constitutive and User?Supplied Subroutines for Solders Considering Damage Evolution (pages 45–78):
Chapter 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages (pages 79–101):
Chapter 5 Multi?Physics and Multi?Scale Modeling (pages 103–108):
Chapter 6 Modeling Validation Tools (pages 109–133):
Chapter 7 Application of Fracture Mechanics (pages 135–167):
Chapter 8 Concurrent Engineering for Microelectronics (pages 169–184):
Chapter 9 Typical IC Packaging and Assembly Processes (pages 185–253):
Chapter 10 Opto Packaging and Assembly (pages 255–265):
Chapter 11 MEMS and MEMS Package Assembly (pages 267–359):
Chapter 12 System in Package (SIP) Assembly (pages 361–394):
Chapter 13 Wafer Probing Test (pages 395–412):
Chapter 14 Power and Thermal Cycling, Solder Joint Fatigue Life (pages 413–439):
Chapter 15 Passivation Crack Avoidance (pages 441–452):
Chapter 16 Drop Test (pages 453–471):
Chapter 17 Electromigration (pages 473–497):
Chapter 18 Popcorning in Plastic Packages (pages 499–517):
Chapter 19 Classical Molecular Dynamics (pages 519–551):