Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

✍ Scribed by Yong Liu (auth.)

Publisher: Springer-Verlag New York
Year: 2012
Tongue: English
Leaves: 605
Edition: 1
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling.
Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each tasks unique characteristics.

✦ Table of Contents

Front Matter....Pages i-xviii
Challenges of Power Electronic Packaging....Pages 1-8
Power Package Electrical Isolation Design....Pages 9-26
Discrete Power MOSFET Package Design and Analysis....Pages 27-56
Power IC Package Design and Analysis....Pages 57-88
Power Module/SiP/3D/Stack/Embedded Packaging Design and Considerations....Pages 89-166
Thermal Management, Design, and Cooling for Power Electronics....Pages 167-213
Material Characterization for Power Electronics Packaging....Pages 215-282
Power Package Typical Assembly Process....Pages 283-344
Power Packaging Typical Reliability and Test....Pages 345-425
Power Packaging Modeling and Challenges....Pages 427-463
Power Package Thermal and Mechanical Codesign Simulation Automation....Pages 465-515
Power Package Electrical and Multiple Physics Simulation....Pages 517-574
Back Matter....Pages 575-591

✦ Subjects

Power Electronics, Electrical Machines and Networks;Electronics and Microelectronics, Instrumentation;Solid State Physics;Spectroscopy and Microscopy;Circuits and Systems

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