Chip Scale Package: Design, Materials, Process, Reliability, and Applications

✍ Scribed by John H. Lau, Ricky S.W. Lee, Ricky S. Lee

Publisher: McGraw-Hill Professional
Year: 1999
Tongue: English
Leaves: 570
Edition: 1
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youOll see why itOs the resource of choice for those who want to be at the top of the game.

📜 SIMILAR VOLUMES

Chip Scale Package: Design, Materials, P

📁 Chip Scale Package: Design, Materials, Process, Reliability, and Applications

✍ John H. Lau, Ricky S.W. Lee, Ricky S. Lee 📂 Library 📅 1999 🏛 McGraw-Hill Professional 🌐 English

Micro- and Opto-Electronic Materials and

📁 Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics Materials ... Physical Design Reliability and Packaging

✍ Ephraim Suhir 📂 Library 📅 2007 🏛 Springer 🌐 English

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and

Micro- and Opto-Electronic Materials and

📁 Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging

✍ Ephraim Suhir (editor), Y.C. Lee (editor), C.P. Wong (editor) 📂 Library 📅 2007 🏛 Springer 🌐 English

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reli

Die-Attach Materials for High Temperatur

📁 Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

✍ Kim S. Siow 📂 Library 📅 2019 🏛 Springer International Publishing 🌐 English

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use o

Wafer-Level Chip-Scale Packaging: Analog

📁 Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

✍ Shichun Qu, Yong Liu (auth.) 📂 Library 📅 2015 🏛 Springer-Verlag New York 🌐 English

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog techn

Power Electronic Packaging: Design, Asse

📁 Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

✍ Yong Liu (auth.) 📂 Library 📅 2012 🏛 Springer-Verlag New York 🌐 English

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging desig