Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

✍ Scribed by Kim S. Siow

• Publisher: Springer International Publishing
• Year: 2019
• Tongue: English
• Leaves: 291
• Edition: 1st ed.
• Category: Library

✦ Synopsis

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.

• Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;
  
• Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;
  
• Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
  

✦ Table of Contents

Front Matter ....Pages i-xx
Silver Sintering and Soldering: Bonding Process and Comparison (S. Chen, H. Zhang)....Pages 1-33
Sintered Silver for LED Applications (H. Zhang, K. Suganuma)....Pages 35-65
Process Control of Sintered Ag Joint in Production for Die Attach Applications (K. S. Siow, V. R. Manikam, S. T. Chua)....Pages 67-105
Thermomechanical Modeling of High-Temperature Bonded Interface Materials (P. P. Paret, D. J. DeVoto, S. V. J. Narumanchi)....Pages 107-124
Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint (Y. H. Mei, Z. Wang, K. S. Siow)....Pages 125-150
Morphological Changes in Sintered Silver Due to Atomic Migration (S. Mannan, A. Paknejad, A. Mansourian, K. Khtatba)....Pages 151-163
Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials (K. S. Siow)....Pages 165-180
Sintered Copper (Cu): Chemistry, Process, and Reliability (Y. Yamada)....Pages 181-196
Transient Liquid Phase Bonding (J. R. Holaday, C. A. Handwerker)....Pages 197-249
Die-Attach Materials for Extreme Conditions and Harsh Environments (Z. Shen, O. Fanini)....Pages 251-274
Back Matter ....Pages 275-279

✦ Subjects

Materials Science; Optical and Electronic Materials; Electronics and Microelectronics, Instrumentation; Metallic Materials; Characterization and Evaluation of Materials; Materials Engineering; Quality Control, Reliability, Safety and Risk