Hermeticity testing of MEMS and microelectronic packages
โ Scribed by Costello, Suzanne; Desmulliez, Marc P. Y
- Publisher
- Artech House
- Year
- 2013
- Tongue
- English
- Leaves
- 197
- Series
- Artech House integrated microsystems series
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Table of Contents
Content: Machine generated contents note: References --
pt. 1 Introduction to Hermetic Packages and Leak Types --
1. The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication --
1.1. Introduction --
1.2. The Evolution of Microelectronics and MEMS Packages --
1.3. MEMS Sealing Techniques and Mode Package Fabrication --
1.3.1. Materials --
1.3.2. Sealing Techniques --
1.4. Summary of MEMS Packaging Materials and Techniques --
References --
2. Assembly, Packaging, and Environmentally Induced Failures in MEMS --
2.1. Introduction --
2.2. Particle Contamination --
2.3. Thermomechanical Constraints --
2.3.1. Thermomechanical Constraints in Die Attach --
2.3.2. Thermomechanical Constraints in Package-Level Encapsulation --
2.3.3. Thermomechanical Constraints in Wafer-Level Encapsulation --
2.3.4. Thermomechanical Constraints in Flip-Chip Bonding --
2.4. Moisture and Gas Absorption --
2.4.1. Moisture Absorption --
2.4.2. Barrier Coatings: A Protection Against Moisture Absorption --
2.4.3. Outgassing --
2.5. Conclusions: Reliability Demonstration and Accelerated Testing --
References --
3. Packaging Requirements for Hermeticity --
3.1. The Need for Hermeticity in MEMS and Microelectronics Packaging --
3.2. Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package --
References --
4. The Different Types of Leaks in MEMS and Microelectronics Packaging --
4.1. Introduction --
4.2. Leak Channels or Capillary Leaks --
4.3. Permeation --
4.4. Outgassing --
4.5. Conclusion --
References --
pt. 2 Traditional Hermeticity Test Techniques and Standards --
5. Ex Situ Hermeticity Test Methods --
5.1. Introduction --
5.2. Fine Leak Tests --
5.2.1. Helium Fine Leak Test --
5.2.2. Radioisotope Leak Detection Method --
5.3. Gross Leak Tests --
5.3.1. Fluorocarbon Liquid and Vapor Gross Leak Detection --
5.3.2. Gross Bubble Test --
5.3.3. Weight Gain --
5.3.4. Dye Penetrant Gross Leak Test --
5.4.Combinational Tests --
5.4.1. Optical Fine/Gross Leak Detection Method --
5.4.2. Cumulative Helium Leak Detection (CHLD) Method --
References --
6. The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 --
6.1. Introduction: The First Hermeticity Tests --
6.2. The Introduction of the Military Standards --
6.3. The First Problems with Traditional Hermeticity Tests and Standards --
6.4. Military Standard Revisions --
6.5. Summary --
References --
pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages --
7. Permeation --
7.1. Introduction --
7.2. Mathematics of Permeation --
7.3. Limitations of the Packaging Material --
7.4. Conclusions --
References --
8. Outgassing and Residual Gas Analysis (RGA) --
8.1. Outgassing --
8.2. Residual Gas Analysis --
References --
9. Low-Cavity Volume Capillary Leak Limitations --
9.1. Limitations of the Helium Fine Leak Test Method --
9.1.1. Volume Limitations --
9.1.2. Minimum Detectable Leak Rate --
References --
pt. 4 Novel Methods of Leak Detection --
10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method --
10.1. Introduction --
10.2. Lumped Element Modeling of a Microresonator --
10.3. Definitions and Measurement Methods of the Quality Factor Q --
10.3.1. Definition in Terms of Stored Energy --
10.3.2. Definition in Terms of Bandwidth --
10.3.3. Determination of the Q-Factor by Amplitude-Frequency Measurement --
10.3.4. Determination of the Q-Factor by Phase Measurement --
10.4. Relation Between Pressure and Q-Factor --
References --
11. In Situ Test Methods in Development --
11.1. Introduction --
11.2. Copper Test Structures --
11.3. Micro-Pirani Gauge --
References --
12. Ex Situ Hermeticity Test Methods in Development --
12.1. Introduction --
12.2. FTIR Spectroscopy --
12.2.1. Application to Hermeticity --
12.2.2. Theoretical Limitations --
12.2.3. Practical Considerations --
12.2.4. Summary --
12.3. Raman Spectroscopy --
12.3.1. Application to the Hermeticity Test --
12.3.2. Theoretical Limitations --
12.3.3. Practical Considerations --
12.3.4. Summary --
References --
pt. 5 Conclusions and Vision --
13. Summary of Hermeticity Test Methods --
14. The Way Forward --
14.1. Introduction --
14.2. Improvement on Existing Techniques --
14.3. New Hermetic Materials and Hermeticity Test Methods --
14.4. Conclusions --
References.
โฆ Subjects
Microelectromechanical systems.;Microelectronics.;Microelectromechanical systems -- Testing.;Microelectronics -- Testing.
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