<p><P><EM>RF and Microwave Microelectronics Packaging</EM> presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding le
RF and Microwave Microelectronics Packaging
β Scribed by Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)
- Publisher
- Springer US
- Year
- 2010
- Tongue
- English
- Leaves
- 295
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Subjects
Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems
π SIMILAR VOLUMES
<p><P><EM>RF and Microwave Microelectronics Packaging</EM> presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding le
<p><p>This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to βRF and Microwave Microelectronics Packagingβ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging
"If you're an electrical engineer, this book brings together all the RF design principles you need to know to participate in the wireless revolution. It covers a wide range of issues relevant to today's advanced RF integrated circuits and systems - the technology at the heart of wireless phones, p
This book is designed to give electrical engineers the RF microelectronics background they need to design state-of-the-art consumer electronics and communications devices.RF Microelectronics begins with a thorough introduction to the fundamental concepts of RF design, including nonlinearity, interfe