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RF and Microwave Microelectronics Packaging

✍ Scribed by Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)


Publisher
Springer US
Year
2010
Tongue
English
Leaves
295
Edition
1
Category
Library

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✦ Subjects


Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems


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