RF and Microwave Microelectronics Packaging II

✍ Scribed by Ken Kuang, Rick Sturdivant (eds.)

• Publisher: Springer International Publishing
• Year: 2017
• Tongue: English
• Leaves: 177
• Edition: 1
• Category: Library

✦ Synopsis

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

✦ Table of Contents

Front Matter....Pages i-xii
Introduction to Radio Frequency and Microwave Microelectronic Packaging....Pages 1-17
Packaging of Transmit/Receive Modules....Pages 19-32
3D Transitions and Connections....Pages 33-42
Electromagnetic Shielding for RF and Microwave Packages....Pages 43-62
Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate....Pages 63-73
Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package....Pages 75-82
Chip Size Packaging (CSP) for RF MEMS Devices....Pages 83-97
The Challenge in Packaging and Assembling the Advanced Power Amplifiers....Pages 99-112
High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond....Pages 113-127
Advancement in High Thermal Conductive Graphite for Microelectronic Packaging....Pages 129-145
Carbon Nanotubes and Graphene for Microwave/RF Electronics Packaging....Pages 147-167
Back Matter....Pages 169-172

✦ Subjects

Electronics and Microelectronics, Instrumentation;Microwaves, RF and Optical Engineering;Circuits and Systems