Area Array Packaging Handbook: Manufacturing and Assembly

✍ Scribed by Ken Gilleo

Publisher: McGraw-Hill Professional
Year: 2001
Tongue: English
Leaves: 782
Edition: 1
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

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