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Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints

โœ Scribed by R.S. Sidhu; X. Deng; N. Chawla

Publisher
The Minerals, Metals & Materials Society
Year
2007
Tongue
English
Weight
798 KB
Volume
39
Category
Article
ISSN
1073-5623

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