𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints

✍ Scribed by R.S. Sidhu; N. Chawla

Publisher
The Minerals, Metals & Materials Society
Year
2008
Tongue
English
Weight
973 KB
Volume
39
Category
Article
ISSN
1073-5623

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

ChemInform Abstract: Tensile Properties
ChemInform Abstract: Tensile Properties and Microstructural Characterization of Snβ€”0.7Cuβ€”0.4Co Bulk Solder Alloy for Electronics Applications
✍ Cristina Andersson; Peng Sun; Johan Liu πŸ“‚ Article πŸ“… 2008 πŸ› John Wiley and Sons βš– 15 KB

## Abstract ChemInform is a weekly Abstracting Service, delivering concise information at a glance that was extracted from about 200 leading journals. To access a ChemInform Abstract of an article which was published elsewhere, please select a β€œFull Text” option. The original article is trackable v