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Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy

✍ Scribed by Noboru Wade; Tatsuo Akuzawa; Seiji Yamada; Daigo Sugiyama; Ick-Soo Kim; Kazuya Miyahara

Publisher
Springer US
Year
1999
Tongue
English
Weight
333 KB
Volume
28
Category
Article
ISSN
0361-5235

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## Abstract The Sn‐Zn alloys have been considered as lead‐free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro‐creep of the Sn‐9Zn lead‐free solders were investigated. It is shown that the a