✦ LIBER ✦

Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders

✍ Scribed by J. G. Maveety; P. Liu; J. Vijayen; F. Hua; E. A. Sanchez

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Investigation on impact strength of the

✍ Ning Zhang; Yaowu Shi; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 640 KB

Experiments and simulations of uniaxial

✍ Takuji Kobayashi; Katsuhiko Sasaki 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 954 KB

Dissolution and interface reactions betw

✍ Paul T. Vianco; Robert D. Wright; Paul F. Hlava; Joseph J. Martin 📂 Article 📅 2006 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 532 KB

The effects of cooling rate on microstru

✍ F. Ochoa; J. J. Williams; N. Chawla 📂 Article 📅 2003 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 940 KB

Effect of Interfacial Reaction on the Te

✍ Z. Chen; M. He; A. Kumar; G.J. Qi 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 753 KB

Effect of cooling rate on microstructure

✍ Jeff Sigelko; S. Choi; K. N. Subramanian; James P. Lucas; T. R. Bieler 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 290 KB