✦ LIBER ✦

Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

✍ Scribed by Paul T. Vianco; Robert D. Wright; Paul F. Hlava; Joseph J. Martin

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Dissolution and Interface Reactions betw

✍ Paul T. Vianco; Jerome A. Rejent; Gary L. Zender; Paul F. Hlava 📂 Article 📅 2010 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 971 KB

Effect of cooling rate on microstructure

✍ J. G. Maveety; P. Liu; J. Vijayen; F. Hua; E. A. Sanchez 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 846 KB

Investigation on impact strength of the

✍ Ning Zhang; Yaowu Shi; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 640 KB

Comparison of drop performance between t

✍ Ning Zhang; Yaowu Shi; Fu Guo; Yongping Lei; Zhidong Xia; Zhenhua Chen; Li Tian 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 760 KB

Time-independent mechanical and physical

✍ Paul T. Vianco; Jerome A. Rejent; Alice C. Kilgo 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 592 KB

Solderability testing of 95.5Sn-3.9Ag-0.

✍ Edwin P. Lopez; Paul T. Vianco; Jerome A. Rejent 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 288 KB