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Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test

✍ Scribed by Ning Zhang; Yaowu Shi; Fu Guo; Yongping Lei; Zhidong Xia; Zhenhua Chen; Li Tian

Publisher: Springer US
Year: 2010
Tongue: English
Weight: 760 KB
Volume: 22
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-010-0131-x

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