Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar

✍ Scribed by Edwin P. Lopez; Paul T. Vianco; Jerome A. Rejent

• Publisher: Springer US
• Year: 2003
• Tongue: English
• Weight: 288 KB
• Volume: 32
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-003-0218-8