Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

✍ Scribed by Paul T. Vianco; Jerome A. Rejent; Gary L. Zender; Paul F. Hlava

• Publisher: The Minerals, Metals & Materials Society
• Year: 2010
• Tongue: English
• Weight: 971 KB
• Volume: 41
• Category: Article
• ISSN: 1073-5623
• DOI: 10.1007/s11661-010-0406-0