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The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

✍ Scribed by F. Ochoa; J. J. Williams; N. Chawla


Publisher
The Minerals, Metals & Materials Society
Year
2003
Tongue
English
Weight
940 KB
Volume
55
Category
Article
ISSN
1047-4838

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