Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5reinforcements

✍ Scribed by Jeff Sigelko; S. Choi; K. N. Subramanian; James P. Lucas; T. R. Bieler

• Publisher: Springer US
• Year: 1999
• Tongue: English
• Weight: 290 KB
• Volume: 28
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-999-0155-2