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Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder

✍ Scribed by E. Çadırlı; M. Şahin


Publisher
Springer US
Year
2011
Tongue
English
Weight
811 KB
Volume
23
Category
Article
ISSN
0957-4522

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