Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder

✍ Scribed by E. Çadırlı; M. Şahin

• Publisher: Springer US
• Year: 2011
• Tongue: English
• Weight: 811 KB
• Volume: 23
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-011-0398-6