𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

✍ Scribed by F. Ochoa; J. J. Williams; N. Chawla


Publisher
Springer US
Year
2003
Tongue
English
Weight
203 KB
Volume
32
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES