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Effects of laser parameters on the characteristics of a Sn-3.5 wt.%Ag solder joint

✍ Scribed by Jeng-O Kim; Jae-Pil Jung; Jae-Hoon Lee; Jeong-Suh; Hee-Shin Kang

Publisher
TechnoPress
Year
2009
Tongue
English
Weight
871 KB
Volume
15
Category
Article
ISSN
1598-9623

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✍ Jin Yu; J.Y. Kim πŸ“‚ Article πŸ“… 2008 πŸ› Elsevier Science 🌐 English βš– 692 KB

Solder joints of Cu/Sn-3.5Ag were prepared using Cu foil or electroplated Cu films with or without SPS additive. With a high level of SPS in the Cu electroplating bath, voids tended to localize at the Cu/Cu 3 Sn interface during subsequent aging at 150 Β°C, which was highly detrimental to the drop im