✦ LIBER ✦

On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys

✍ Scribed by Rajen S. Sidhu; Shantanu V. Madge; Xin Deng; Nikhilesh Chawla

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

The effect of Ag content on the formatio

✍ Huann-Wu Chiang; Kenndy Chang; Jun-Yuan Chen 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 384 KB

The effects of third alloying elements o

✍ Jun Shen; Shiqiang Lai; Yongchang Liu; Houxiu Gao; Jun Wei 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 381 KB

Reaction diffusions of Cu6Sn5and Cu3Sn i

✍ Jeong -Won Yoon; Chang -Bae Lee; Dae -Up Kim; Seung -Boo Jung 📂 Article 📅 2003 🏛 TechnoPress 🌐 English ⚖ 624 KB

Interfacial reactions between Sn-3.5 Ag

✍ A. S. M. A. Haseeb; C. S. Chew; Mohd Rafie Johan 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 287 KB

Effect of soldering and aging time on in

✍ Won Kyoung Choi; Hyuck Mo Lee 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 474 KB

The morphology and kinetic evolution of

✍ S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 960 KB