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Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates

โœ Scribed by Feng Gao; Hiroshi Nishikawa; Tadashi Takemoto

Publisher
Springer US
Year
2007
Tongue
English
Weight
360 KB
Volume
37
Category
Article
ISSN
0361-5235

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Effects of residual S on Kirkendall void
Effects of residual S on Kirkendall void formation at Cu/Snโ€“3.5Ag solder joints
โœ Jin Yu; J.Y. Kim ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 692 KB

Solder joints of Cu/Sn-3.5Ag were prepared using Cu foil or electroplated Cu films with or without SPS additive. With a high level of SPS in the Cu electroplating bath, voids tended to localize at the Cu/Cu 3 Sn interface during subsequent aging at 150 ยฐC, which was highly detrimental to the drop im