✦ LIBER ✦

Suppression of Cu3Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

✍ Scribed by Chun Yu; Yang Yang; Peilin Li; Junmei Chen; Hao Lu

Publisher: Springer US
Year: 2011
Tongue: English
Weight: 356 KB
Volume: 23
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-011-0412-z

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effects of residual S on Kirkendall void

Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

✍ Jin Yu; J.Y. Kim 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 692 KB

Solder joints of Cu/Sn-3.5Ag were prepared using Cu foil or electroplated Cu films with or without SPS additive. With a high level of SPS in the Cu electroplating bath, voids tended to localize at the Cu/Cu 3 Sn interface during subsequent aging at 150 °C, which was highly detrimental to the drop im

The morphology and kinetic evolution of

The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3composite solder/Cu interface during soldering reaction

✍ S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 960 KB

Suppressing the growth of interfacial Cu

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

✍ Wei-Yu Chen; Chi-Yang Yu; Jenq-Gong Duh 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 798 KB

Degradation of Sn37Pb and Sn3.5Ag0.5Cu s

Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

✍ B. Y. Wu; H. W. Zhong; Y. C. Chan; M. O. Alam 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 518 KB

Effect of small Sn–3.5Ag–0.5Cu additions

Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages

✍ Asit Kumar Gain; Y.C. Chan; Ahmed Sharif; Winco K.C. Yung 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 1011 KB

Effects of small amounts of Ni/P/Ce elem

Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy

✍ Wenxing Dong; Yaowu Shi; Yongping Lei; Zhidong Xia; Fu Guo 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 712 KB