Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

✍ Scribed by B. Y. Wu; H. W. Zhong; Y. C. Chan; M. O. Alam

• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 518 KB
• Volume: 17
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-006-0048-6