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Effects of Current Stressing on Formation and Evolution of Kirkendall Voids at Sn–3.5Ag/Cu Interface

✍ Scribed by C. Yu; Y. Yang; H. Lu; J. M. Chen

Publisher: Springer US
Year: 2010
Tongue: English
Weight: 605 KB
Volume: 39
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-010-1201-9

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