✦ LIBER ✦
Microstructures and degradation of heat sink very-thin quad flat package no-leads Pb-free Sn-Ag-Cu solder joints after thermal aging
✍ Scribed by W. Fredriksz
- Publisher
- Springer US
- Year
- 2005
- Tongue
- English
- Weight
- 522 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0361-5235
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