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Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels

✍ Scribed by X. P. Zhang; L. M. Yin; C. B. Yu

Publisher: Springer US
Year: 2007
Tongue: English
Weight: 523 KB
Volume: 19
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-007-9351-0

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