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Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

✍ Scribed by X. P. Zhang; C. B. Yu; S. Shrestha; L. Dorn

Publisher: Springer US
Year: 2006
Tongue: English
Weight: 453 KB
Volume: 18
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-006-9078-3

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