Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures

✍ Scribed by K. Fakpan; Y. Otsuka; Y. Mutoh; S. Inoue; K. Nagata; K. Kodani

• Publisher: Elsevier
• Year: 2011
• Tongue: English
• Weight: 612 KB
• Volume: 10
• Category: Article
• ISSN: 1877-7058
• DOI: 10.1016/j.proeng.2011.04.206

✦ Synopsis

Fatigue crack growth tests of lead-contained (Sn-37Pb) and lead-free (Sn-3.0Ag-0.5Cu) solders were conducted under frequencies ranged from 10 to 0.1 Hz and a stress ratio of 0.1 at room temperature and 70C. J-integral range (J) and modified J-integral (C  ) were used for discussing about cycle-dependent and time-dependent crack growth behavior for both the solders. The experimental results showed that crack growth behavior of both the solders was predominantly time-dependent at lower frequency and higher temperature, while it was predominantly cycledependent at higher frequency and lower temperature. Under the present test condition of stress ratio of 0.1, when the frequency was higher than 0.5 Hz at room temperature and 1 Hz at 70C for both the solders, crack growth behavior was cycle-dependent. The crack growth resistance of lead-free solder was higher than that of lead-contained solder, which was much significant in time-dependent region. From the fracture surface observations, it was found that as the frequency decreased and/or the temperature increased, the fracture surface appearance changed from transgranular to intergranular manner for both the solders.