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Metallization of sub-micron trenches and vias with high aspect ratio

✍ Scribed by P Siemroth; Ch Wenzel; W Klimes; B Schultrich; T Schülke


Book ID
114086211
Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
834 KB
Volume
308-309
Category
Article
ISSN
0040-6090

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