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High aspect ratio sub-micron trenches on silicon-on-insulator and bulk silicon

✍ Scribed by M. Hermersdorf; C. Hibert; D. Grogg; A.M. Ionescu

Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
545 KB
Volume
88
Category
Article
ISSN
0167-9317

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Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures
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Different processes involving an inductively coupled plasma reactor are presented either for deep reactive ion etching or for isotropic etching of silicon. On one hand, high aspect ratio microstructures with aspect ratio up to 107 were obtained on sub-micron trenches. Application to photonic MEMS is