✦ LIBER ✦

Investigation on enhancement of copper ball bonds during thermal cycle testing

✍ Scribed by Onuki, J.; Koizumi, M.; Suzuki, H.; Araki, I.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

An analysis of intermetallics formation

✍ S Murali; N Srikanth; Charles J Vath III 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 243 KB

Investigation of the transfer of Cu2+ io

✍ A.I. Kuzavkov; I.L. Ugolev; N.I. Yegorenkov 📂 Article 📅 1991 🏛 Elsevier Science ⚖ 488 KB

Effects of line and passivation geometry

✍ T.-S Park; S Suresh 📂 Article 📅 2000 🏛 Elsevier Science 🌐 English ⚖ 813 KB

A new methodology for the identification

✍ Bahi Manoubi Auguste; Fremont Hélène; Landesman Jean-Pierre; Gentil Annabelle; L 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 489 KB

Influence of alkali, alkaline earth, and

✍ Ronald L. Dotson 📂 Article 📅 1974 🏛 Elsevier Science ⚖ 276 KB

[IEEE 1997 1st Electronic Packaging Tech

✍ Ricky Lee, S.-W.; Yan, C.C.; Chow, L.W.; Papageorge, M. 📂 Article 📅 1997 🏛 IEEE ⚖ 719 KB