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An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

✍ Scribed by S Murali; N Srikanth; Charles J Vath III

Book ID: 114066308
Publisher: Elsevier Science
Year: 2003
Tongue: English
Weight: 243 KB
Volume: 38
Category: Article
ISSN: 0025-5408
DOI: 10.1016/s0025-5408(03)00004-7

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