𝔖 Bobbio Scriptorium

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[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Effects of Barrier Layer on Copper-to-Silicon Diffusion and Intermetallic Compound Formation in Copper Wire Bonding

✍ Scribed by Zhang, S.; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.

Book ID: 126603614
Publisher: IEEE
Year: 2006
Weight: 869 KB
Category: Article
ISBN-13: 9781424402601
DOI: 10.1109/ISAPM.2006.1665988

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