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[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Advanced composites and other advanced materials for electronic packaging thermal management

✍ Scribed by Zweben, C.

Book ID: 120088996
Publisher: IEEE
Year: 2001
Tongue: English
Weight: 433 KB
Category: Article
ISBN-13: 9780930815646
DOI: 10.1109/ISAOM.2001.916602

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