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[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Rubber stamped plastic circuits for electronic paper

✍ Scribed by Rogers, J.A.; Baldwin, K.; Zhenan Bao, ; Dodabalapur, A.; Raju, V.R.; Ewing, J.; Amundson, K.

Book ID: 126630337
Publisher: IEEE
Year: 2001
Weight: 626 KB
Category: Article
ISBN-13: 9780930815646
DOI: 10.1109/ISAOM.2001.916556

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